This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. Zero halogen (no halogen intentionally added to the formulation). ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications.Compatible with either nitrogen or air reflow.Excellent reliability properties, halide-free material.It originates at ambient temperature and ends at the peak temperature. The ramp rate is the slope of temperature versus time for the heating portion of the reflow profile. Meets highest IPC 7095 voiding performance classification Class III. The actual reflow of the solder alloy involves the creation of a mechanical and electrical bond through the formation of ti n-copper intermetallics. ![]() Reduction in random solderballing levels, minimising reworkand increasing first-time yield.Best in class in circuit pin test yield.Excellent solder and flux cosmetics after reflow soldering.Wide reflow profile window with good solderability on various board/component finishes.The most common are solder paste and component manufacturers. ALPHA® OM-353 Solder Paste No-Clean, Low-Silver, Lead-Free, Zero-Halogen, ROL0, Ultra-Fine Feature Print & Air Reflow Capable Solder Paste DESCRIPTION ALPHA OM-353 is a Low Silver & SAC305 capable paste designed for Type 5 (15 25µm) powder to meet market segments requiring ultra-fine features application. Print speeds of up to 150mm/sec (6"/sec), enabling a fast print cycle time and a high throughput. There are several sources for how a reflow profile graph should look like.Excellent print consistency with high process capability index across all board designs.Maximises reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.275mm (0.011") with 0.100mm thick stencils.Features & Benefits Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features Able to spread and wet using straight ramp or soak reflow profiles in air High spread/wetting lead free paste compatible with lead free alloys and surface finishes High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). This paste is designed to enable users of ALPHA WS-609, WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials. ALPHA WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to increase the reflow profile window of WS-819, while offering exceptional post reflow cleanability and low BGA voiding. JIS Spread 88.6% on Entek HT OSP ? Cleanable with water based cleaning systems PRODUCT INFORMATION ? Alloys: SAC305, SAC405, SACX Plus 0807, 96.5Sn3.5Ag, 95.5Sn3.8Ag0.7Cu, 95.5Sn4Ag0.5Cu & Innolot ? Application: Stencil printing (87.6% Metal Loading, M19 Viscosity) Dispense application (84.8% Metal Loading, Type 3 Powder, M7 Viscosity) ? Powder Size: Type 3 & Type 4 ? RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/EC Solder Paste ALPHA WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste. ![]() FEATURES & BENEFITS ? Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features ? Able to spread and wet using straight ramp or soak reflow profiles in air ? High spread/wetting lead free paste compatible with lead free alloys and surface finishes ? High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components ? Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). ![]() ![]() Additionally, the ROL0 IPC classification of ALPHA OM-338-T ensures maximum long-term product reliability. This material is engineered to deliver the comparable performance to a tin-lead process. ALPHA OM-338-PT’s broad processing window is designed to minimize transition concerns from tin-lead to lead-free solder paste. ALPHA OM-338-T is formulated to deliver excellent visual joint cosmetics and clear, colorless flux residues. ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA WS-820 WATER SOLUBLE, LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA WS-820 a lead free, halide free solder paste offering the ideal combination of printability and reflow profile process window, with excellent cleanability in a lead free alloy solder paste. ALPHA OM-338-T is a no-clean paste flux designed for a broad range of applications, including rework of components.
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